- Mixing putty, paste-like high viscosity resin
- Dispersive mixing of liquid and powder
- Processing of liquid with thixotropic
- Mixing of low viscosity liquid chemicals
- Processing of resin products such as adhesives
- Processing of resin for civil engineering and building materials
- Subdivided filling of liquid and powder
Electronics Contract Manufacturing Services
Utilizing the high level of mixing and dispersion technology accumulated since its establishment in 1930, the company meets the needs of cutting-edge materials for the electronics industry and the production of products for various purposes. With advanced mixing and dispersion technologies since establishment in 1930, we meet the customers’ needs for commercialization of various applications, including cutting edge materials for electronics industry.
We undertake following mass production processing
- Processing of cutting-edge electronic materials
- Mixing of metal powder and binder resin
- Dispersive mixing of particulates (Fillers)
- Mixing of higher filler content resin filling
- Processing of micro-particle resin compound
- Tablet processing
Processing equipment list
For mixing large volume liquid | For mixing and processing powder |
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