Product information - High-performance resin material manufacturer Nihon Gosei Kako Co., Ltd.

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Product name	Material	Characteristics	Application
TM-250	Molding materials Epoxy	Flame retardant Hardness High flow Water resistance Insulating properties Low linear expansion Low Shrinkage RoHS	Precision parts molding
U-640A/B	Urethane Casting materials	Insulating properties RoHS Low temperature molding Flame retardant Flexibility Heat shock resistance Low viscosity Water resistance	Precision mechanical parts Sensor encapsulation Coil encapsulation Base resin
ER-5061FA/B	Epoxy Casting materials	Water resistance Insulating properties Adhesion RoHS Flame retardant Hardness Heat resistance High flow	Precision mechanical parts Base encapsulation Sensor encapsulation Coil encapsulation
VX-8740A/B	Casting materials Epoxy	Insulating properties Adhesion RoHS Hardness Curing at room temperature
OR-29	Molding materials Epoxy	RoHS Magnetic Hardness Heat resistance High flow	Magnetic materials Coil encapsulation Compression Transfer
U-7605A/B	Urethane Casting materials	RoHS Flame retardant Flexibility Heat shock resistance Heat resistance High flow Water resistance Insulating properties	Precision mechanical parts Base encapsulation Sensor encapsulation
VX-3528A/B	Epoxy Casting materials	RoHS Flame retardant Hardness Heat shock resistance Heat resistance Water resistance Thermal conductivity Insulating properties Low linear expansion Low Shrinkage Low elasticity	Base encapsulation Power module encapsulation Sensor encapsulation Coil encapsulation Electronic component encapsulation
ER-6506FA/B	Epoxy Casting materials	RoHS Flame retardant Flexibility Heat shock resistance High flow Water resistance Insulating properties	Base encapsulation Sensor encapsulation Coil encapsulation
U-331A/B	Urethane Casting materials	Flexibility Heat shock resistance High flow Low viscosity Curing at room temperature Water resistance Insulating properties Adhesion RoHS	Base encapsulation Sensor encapsulation Precision mechanical parts
ER-3681FA/B	Casting materials Epoxy	Water resistance Insulating properties Low linear expansion Low Shrinkage High strength RoHS Flame retardant Hardness Heat shock resistance Heat resistance High flow	Electronic component encapsulation Base encapsulation Power module encapsulation Sensor encapsulation Coil encapsulation