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Product name Material Characteristics Application
VX-3329A-2/B-2
  • Epoxy
  • Casting materials
  • Curing at room temperature
  • Water resistance
  • Thermal conductivity
  • Insulating properties
  • Low linear expansion
  • RoHS
  • Flame retardant
  • Hardness
  • Heat shock resistance
  • Base encapsulation
  • Sensor encapsulation
  • Coil encapsulation
KT-17C20
  • Epoxy
  • Molding materials
  • Hardness
  • High flow
  • Insulating properties
  • Short curing time
  • RoHS
  • Low pressure molding
  • Low temperature molding
  • Transfer
  • Base encapsulation
  • Encapsulation of film capacitors
  • Sensor encapsulation
VX-8760A/B
  • Dip material
  • Epoxy
  • Hardness
  • Heat shock resistance
  • Water resistance
  • Insulating properties
  • Thixotropy
  • RoHS
  • Electronic component encapsulation
  • Sensor encapsulation
SR-25/SH-25
  • Epoxy
  • Casting materials
  • Heat resistance
  • High flow
  • Water resistance
  • Insulating properties
  • Adhesion
  • RoHS
  • Flame retardant
  • Hardness
  • Electronic component encapsulation
  • Base encapsulation
  • Encapsulation of film capacitors
  • Sensor encapsulation
  • Coil encapsulation
U-380A/B
  • Urethane
  • Casting materials
  • Flame retardant
  • Hardness
  • High flow
  • Low viscosity
  • Insulating properties
  • RoHS
  • Precision mechanical parts 
  • Encapsulation of film capacitors
U-365A/B
  • Urethane
  • Casting materials
  • RoHS
  • Flame retardant
  • Flexibility
  • Heat resistance
  • High flow
  • Low viscosity
  • Curing at room temperature
  • Insulating properties
  • Precision mechanical parts 
  • Base encapsulation
  • Encapsulation of film capacitors
  • Sensor encapsulation

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