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For substrate sealant (heat dissipation)

As the performance of electronic components is getting higher and higher, heat productivity is increased. Therefore, it is required to dissipate heat through the heating body so that the electronic components can be stably used. Our company equips the thermosetting resin with heat conductivity. We can offer a variety of products with superior electrical characteristics, mechanical properties, adhesion, heat resistance, moisture resistance, etc.

Notifications List

Product name	Material	Characteristics	Application
VX-3528A/B	Epoxy Casting materials	Insulating properties Low linear expansion Low Shrinkage Low elasticity RoHS Flame retardant Hardness Heat shock resistance Heat resistance Water resistance Thermal conductivity	Base encapsulation Power module encapsulation Sensor encapsulation Coil encapsulation Electronic component encapsulation
ER-6700FA/B	Epoxy Casting materials	Flame retardant Hardness Heat shock resistance Heat resistance High flow Water resistance Insulating properties Low linear expansion RoHS	Base encapsulation Power module encapsulation Sensor encapsulation Coil encapsulation Precision mechanical parts
VX-3329A-2/B-2	Casting materials Epoxy	Hardness Heat shock resistance Curing at room temperature Water resistance Thermal conductivity Insulating properties Low linear expansion RoHS Flame retardant	Base encapsulation Sensor encapsulation Coil encapsulation